High Quality Molybdenum Sputtering Targets

Product Details
Application: Aviation, Electronics, Industrial, Medical, Chemical
Standard: JIS, GB, DIN, BS, ASTM, AISI
Purity: >99.95%
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Number of Employees
9
Year of Establishment
2014-03-27
  • High Quality Molybdenum Sputtering Targets
  • High Quality Molybdenum Sputtering Targets
  • High Quality Molybdenum Sputtering Targets
  • High Quality Molybdenum Sputtering Targets
  • High Quality Molybdenum Sputtering Targets
  • High Quality Molybdenum Sputtering Targets
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Basic Info.

Model NO.
Moly Target
Alloy
Alloy
Type
Molybdenum Plate
Powder
Not Powder
Transport Package
Wooden Box
Specification
0.02mm--12.0mm diameter
Origin
China
HS Code
8102950000
Production Capacity
1000000meters

Product Description

Molybdenum Sputtering Targets

Description:
Molybdenum sputtering target is widely used in manufacturing LCD and touch screens (panels). It is also used for solar cells and solar water heating. We can provide pure molybdenum and molybdenum alloy targets with different shapes, including disc, planar, rotary as well as custom targets.
High Quality Molybdenum Sputtering Targets
High Quality Molybdenum Sputtering Targets
High Quality Molybdenum Sputtering Targets



Application:
Sputtering is a physical vapor deposition (PVD) method of depositing the evaporated target material onto the surface of the substrate forming a thin film layer.
Sputtering is the preferred vacuum deposition technique used by manufacturers of semiconductors, CDs, disk drives, and optical devices. It is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing. Thin anti-reflection coatings on glass for optical applications are also deposited by sputtering. Sputtered films exhibit excellent uniformity, density, purity, and adhesion.


Operating Principle:
Sputtering target materials for magnetron sputtering deposits, is a new kind of physical vapor deposition (PVD) method
An orthogonal magnetic and electric field is added to the anode and cathode of the sputtering target, and fills the gas (usually the Ar gas) In the high vacuum chamber.
Ar gas ionization into positive ions and electrons. Under the action of electric field, Target has certain negative pressure, Electronic effected by magnetic field and its Ionization probability increases with working gas, then forming high-density of plasma near the cathode, Ar ion under the action of lorentz force, speed up fly to the target surface, bombarding target surface at a high speed, making atoms sputtering from target fly to the substrate deposition film.


Specification:
The Molybdenum sputtering targets we can provide are as follows:
Plate Target: Weight:≤200kg/pc, Purity:≥99.95%
Tube Target: Length:≤Φ165mmΧ1000mm ,Purity:≥99.95%


We can supply molybdenum targets as per customers' requests.
If there are any other specs, please contact us with no hesitation!
Welcome to your inquiry, please contact Wendy.

Content update time:2024.05.31

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